TechDebt 2019 International Conference on Technical Debt
Technical debt describes a universal software development phenomenon: design or implementation constructs that are expedient in the short term but set up a technical context that can make future changes more costly or impossible. Software developers and managers increasingly use the concept to communicate key tradeoffs related to release and quality issues. The goal of this two-day conference is to bring together leading software researchers, practitioners, and tool vendors to explore theoretical and practical techniques that manage technical debt.
The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.
To accelerate progress, an expanded two-day working conference format has become essential. The second edition of the TechDebt Conference will be held jointly with ICSE 2019 in Montreal, Canada, May 26–27, 2019. The conference is sponsored by ACM SIGSOFT and IEEE TCSE.
Call for Papers
The Second International Conference on Technical Debt will be held in Montréal, Canada, on May 26–27, 2019, collocated with ICSE 2019.
Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues.
While other software engineering disciplines—such as software sustainability, maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.
TechDebt 2019 aims to bring together leading software engineering researchers and practitioners to explore theoretical and practical techniques for managing technical debt and to share experiences, challenges, and best practices.
The conference addresses all topics related to technical debt, including
- analysis and measurement of technical debt
- techniques and tools for calculating technical debt principal and interest
- understanding causes and effects of technical debt
- visualization of technical debt
- economic models for describing or reasoning about technical debt
- the business case for technical debt management
- relationship of technical debt to software evolution, maintenance, and aging
- relationship of technical debt with other activities, such as testing or requirements engineering
- relationship of technical debt to DevOps
- relationship of technical debt to quality attributes (especially run-time)
- technical debt management within software life-cycle management
- beyond software—technical debt in systems engineering
- technical debt within software ecosystems and product lines
- technical debt in design and architecture
- technical debt in software models
- concrete practices and tools used to manage technical debt
- education related to technical debt
We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories:
- Research Papers: describing innovative and significant original research in the field (up to 10 pages)
- Experience Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages)
- Short Papers: position and future trend papers describing ongoing research or new results (up to 5 pages)
Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2019 EasyChair conference management system and conform to the ICSE formatting guidelines.
Accepted papers must be presented in person at the conference by one of the authors. Excellent papers will be considered for a Distinguished Paper Award from ACM SIGSOFT.
Calendar for submission:
- January 14: Abstract submitted to EasyChair
- January 21: Full papers entered in EasyChair
- March 1: Notification of acceptance or rejection
- March 15: Camera-ready submission of final paper
- May 26–27: Presentations
TechDebt 2019 is the Second International Conference on Technical Debt. It brings together leading researchers and industry practitioners in this growing field. Tools plays a critical role in understanding the management, monitoring, and calculations of technical debt in real-world situations. We invite organizations and individuals to showcase new techniques, methods, and tools that can aid practitioners and decision makers in these critical tasks to participate at TechDebt 2019, to be held in conjunction with ICSE 2019 in Montréal, Canada.
Extended abstract (1–2 pages): All participants wishing to present, demonstrate, or discuss in the tools forum should submit an extended abstract. Abstracts are due January 14, 2019, via EasyChair. Although extended abstracts are not peer reviewed, abstracts will be screened to ensure they meet the expectations of the tools track and are aligned with the overarching technical debt theme of the conference. In the abstract we suggest that authors address the purpose of the tool, validation experiences with practitioners (if applicable), and its relevance to technical debt. Note: If a longer experience report is available, please direct those submissions to the main track’s experience-reports category.
In EasyChair, indicate how you will participate in the conference session:
- Panel participant: In the panel discussion we will engage participants and audience on how the showcased tools help address technical debt challenges.
- Tool demonstration: If you propose to showcase a product from your company or organization, please let us know your power and space requirements.
- Poster: A poster should describe a tool, or some aspect consistent with tools of the trade. A poster is encouraged if you would like to participate as a panel participant or with a tool demonstration.
To accelerate progress, an expanded two-day working conference format has become essential. The inaugural edition of the TechDebt Conference was held jointly with ICSE 2018 in Gothenburg, Sweden, May 27–28, 2018. Researchers, practitioners, and tool vendors explored theoretical and practical techniques that manage technical debt.
Dagstuhl Seminar: Managing Technical Debt in Software Engineering
A week-long Dagstuhl Seminar on Managing Technical Debt in Software Engineering, April 17 – 22 , 2016, has produced a consensus definition for technical debt, a draft conceptual model, and a research roadmap.
International Workshop on Managing Technical Debt Series
The Managing Technical Debt workshop series has provided a forum since 2010 for practitioners and researchers to discuss issues related to technical debt and share emerging practices used in software-development organizations. Browse the workshop collections.
|Paris Avgeriou, University of Groningen|
|Philippe Kruchten, University of British Columbia|
|Robert L. Nord, Carnegie Mellon Software Engineering Institute|
|Ipek Ozkaya, Carnegie Mellon Software Engineering Institute|
|Carolyn Seaman, University of Maryland Baltimore County|
|Paris Avgeriou||University of Groningen||Program Co-Chair|
|Klaus Schmid||Stiftung University Hildesheim||Program Co-Chair|
|Neil Ernst||University of Victoria||Tools Co-Chair|
|Magiel Bruntink||Software Improvement Group||Tools Co-Chair|
|Esra Alzaghoul||University of Jordan|
|Apostolos Ampatzoglou||University of Macedonia|
|Damian Andrew Tamburri||Eindhoven University of Technology|
|Francesca Arcelli Fontana||University of Milano-Bicocca|
|Rami Bahsoon||University of Birmingham|
|Stephany Bellomo||Software Engineering Institute|
|Terese Besker||Chalmers University of Technology|
|Jan Bosch||Chalmers University of Technology|
|Frank Buschmann||Siemens AG|
|Yuanfang Cai||Drexel University|
|Alexander Chatzigeorgiou||University of Macedonia|
|Marcus Ciolkowski||QAware GmbH|
|Zadia Codabux||Colby College|
|Davide Falessi||California Polytechnic State University|
|Juan Garbajosa||Universidad Politécnica de Madrid|
|Isaac Grifith||Idaho State University|
|Clemente Izurieta||Montana State University|
|Andreas Jedlitschka||Fraunhofer IESE|
|Heiko Koziolek||ABB Corporate Research|
|Philippe Kruchten||The University of British Columbia|
|Ville Leppänen||University of Turku|
|Peng Liang||Wuhan University|
|Antonio Martini||University of Oslo|
|Andrew Meneely||Rochester Institute of Technology|
|Robert Nord||Software Engineering Institute|
|Ken Power||Cisco Systems|
|Narayan Ramasubbu||University of Pittsburgh|
|Gonzalo Rojas||University of Concepción|
|Carolyn Seaman||University of Maryland–Baltimore County|
|Andriy Shapochka||SoftServe, Inc.|
|Emad Shihab||Concordia University|
|Will Snipes||ABB Corporate Research|
|Rodrigo Spinola||Universidade Salvador|
|Wolfgang Trumler||Siemens AG|
|Olaf Zimmermann||HSR FHO|